• DocumentCode
    3232992
  • Title

    Predictive models for co-doping effects between combinations of donors (P/As/Sb) and acceptors (B/Ga/In)

  • Author

    Ahn, Chihak ; Dunham, Scott T.

  • Author_Institution
    Dept. of Phys., Washington Univ., Seattle, WA
  • fYear
    2006
  • fDate
    6-8 Sept. 2006
  • Firstpage
    83
  • Lastpage
    86
  • Abstract
    We studied co-doping effects in silicon using first principles calculations, with particular attention to charge compensation, Coulomb interactions and strain compensation. We find that for B-doped systems, As or Sb counter-doping reduces the hole concentration, but that due to strong binding of multiple P atoms, Ga or In counter-doping can increase electron density in P doped material. For acceptor-acceptor pairing, we find the B-B interaction to be repulsive as expected due to Coulombic effects, but calculations show a surprisingly strong attractive binding between B and In, which we attribute to hole localization. However, B-In binding is not promising for enhancing hole concentration since BIn pairs are deep acceptors. Both donor-acceptor and acceptor-acceptor pairing can be helpful in reducing dopant diffusion leading to more abrupt junctions
  • Keywords
    ab initio calculations; diffusion; doping profiles; electron density; electronic structure; elemental semiconductors; hole density; impurity states; semiconductor doping; silicon; As counter-doping; B-B interaction; B-doped systems; Coulomb interactions; Coulombic effects; P doped material; Sb counter-doping; Si:B-Ga-In; Si:P-As-Sb; acceptor-acceptor pairing; acceptors combinations; charge compensation; co-doping effects; donors combinations; dopant diffusion; electron density; electronic structure; first principles calculations; hole concentration; hole localization; multiple P atoms binding; predictive models; silicon; strain compensation; Capacitive sensors; Charge carrier processes; Chemicals; Electrostatics; MOSFET circuits; Photonic band gap; Physics; Predictive models; Silicon; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2006 International Conference on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    1-4244-0404-5
  • Type

    conf

  • DOI
    10.1109/SISPAD.2006.282844
  • Filename
    4061587