DocumentCode
3233191
Title
Architectural benefits and design challenges for three-dimensional integrated circuits
Author
Xie, Jing ; Zhao, Jishen ; Dong, Xiangyu ; Xie, Yuan
Author_Institution
Comput. Sci. & Eng. Dept., Pennsylvania State Univ., University Park, PA, USA
fYear
2010
fDate
6-9 Dec. 2010
Firstpage
540
Lastpage
543
Abstract
The emerging three-dimensional integrated circuit (3D IC) is one of the promising solutions for future IC design. This tutorial gives an overview of various approaches for future 3D IC design, with the benefits of fast latency, higher bandwidth, and heterogeneous integration capability that are offered by the 3D technology. The design challenges for future 3D ICs are also discussed.
Keywords
integrated circuit design; three-dimensional integrated circuits; 3D IC design; 3D technology; architectural benefits; design challenges; integration capability; three-dimensional integrated circuits; Computer architecture; Irrigation; Testing; Three dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (APCCAS), 2010 IEEE Asia Pacific Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4244-7454-7
Type
conf
DOI
10.1109/APCCAS.2010.5775083
Filename
5775083
Link To Document