DocumentCode
3234396
Title
Electric properties depending on temperature in SiOC dielectric layer
Author
Oh, Teresa
Author_Institution
Cheongju University 1 (School of Electronics and Information Engineering, Cheongju University), China
fYear
2008
fDate
6-9 Jan. 2008
Firstpage
552
Lastpage
556
Abstract
The SiOC films by chemical vapor deposition have been researched the electrical properties by leakage current. The chemical properties of SiOC film was divided into organic, hybrid and inorganic types according to the deposition condition. The leakage current also depended on the chemical properties of the films. The current increased on the SiOC film with polarity, which has many grains. These SiOC film with polarity displayed the increasing the current according to the increasing the substrate temperature. However, the SiOC film without grains decreased the leakage current. Especially, the leakage current of the B27 sample with hybrid type decreased due to the increase the substrate temperature. The dependence on the temperature was only found the sample B27. It was confirmed that the SiOC film with hybrid type is more stable low dielectric materials in high temperature.
Keywords
Annealing; Chemical vapor deposition; Dielectric constant; Dielectric materials; Leakage current; Pentacene; Plasma temperature; Semiconductor films; Substrates; Temperature dependence; SiOC film; leakage current; pentacene deposited surface; polarity;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location
Sanya, China
Print_ISBN
978-1-4244-1907-4
Electronic_ISBN
978-1-4244-1908-1
Type
conf
DOI
10.1109/NEMS.2008.4484393
Filename
4484393
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