• DocumentCode
    3234611
  • Title

    Elastic-plastic adhesive contact of fractal microparts surfaces with low adhesion parameters

  • Author

    Wang, Lefeng ; Rong, Weibin ; Sun, Lining

  • Author_Institution
    Robot. Inst., Harbin Inst. of Technol., Harbin
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    592
  • Lastpage
    595
  • Abstract
    The elastic-plastic adhesive contact model of microparts surfaces with low adhesion parameters is developed based on the fractal rough surfaces description. The critical transition area from elastic to plastic deformation of single asperity contact is determined by the plastic deformation condition. Based on this, the relation between the applied load and the real contact area of rough surfaces are deduced. It has been shown that the fractal dimensions whichever are less or larger than 1.5 have similar effect on the load-area relations. Small applied loads are needed to achieve the same real contact area for the larger fractal dimension in each case duo to the rough surfaces become smoother with the increase of fractal dimensions. The effect of elastic adhesion index on the relation is more remarkable at high load. For the plastic adhesion index, the effect is also prominent at high loads, but the effect trend is contrary to the elastic adhesion one. This is for the index indicates the ration of hardness to the surface adhesion work.
  • Keywords
    adhesion; elastic deformation; fractals; hardness; mechanical contact; plastic deformation; rough surfaces; critical transition; elastic deformation; elastic-plastic adhesive contact model; fractal micropart surfaces; fractal rough surfaces; hardness; low adhesion parameters; plastic deformation; Adhesives; Deformable models; Fractals; OFDM modulation; Plastics; Predictive models; Rough surfaces; Solid modeling; Surface roughness; Systems engineering and theory; adhesive contact; fractal surfaces; low adhesion parameter; microparts;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484402
  • Filename
    4484402