DocumentCode

3234718

Title

Fatigue and Creep in Solder Joints

Author

Homa, Thomas R. ; Huebner, R. Terry

Author_Institution

IBM Corporation, Endicott, NY

fYear

1987

fDate

31896

Firstpage

17

Lastpage

17

Keywords

Capacitors; Creep; Data engineering; Design engineering; Fatigue; Life testing; Packaging; Soldering; Surface-mount technology; Vents;

fLanguage

English

Publisher

ieee

Conference_Titel

Southern Tier Technical Conference, 1987. Proceedings of the 1987 IEEE

Type

conf

DOI

10.1109/STIER.1987.716359

Filename

716359