A multilayer surface mount technology elevated by an aramid-paper and epoxy-resin composite

Author

Tsunashima, Eiichi ; Okuno, Atsushi ; Nagai, Koichirou ; Kadowaki, Mamoru ; Akiyama, Eizo

Author_Institution

Matsushita Electr. Corp., Kyoto, Japan

fYear

1989

fDate

25-27 Sep 1989

Firstpage

289

Lastpage

293

Abstract

Experimental results are presented on an innovative SMT (surface mount technology) aramid-paper/epoxy matrix structure. An investigation of the interlayer adhesion of this composite to copper foils shows that a moderate adhesion force has been kept through the heat aging process without cupric oxide treatment on the foils. Hole piercing by a one-shot punching method and the implementation of printed polymer resistors with improved performance are demonstrated

Keywords

composite insulating materials; organic insulating materials; printed circuits; surface mount technology; Cu foils; MLB; adhesion force; aramid-paper and epoxy-resin composite; aramid-paper/epoxy matrix structure; experimental results; heat aging process; hole piercing; implementation of printed polymer resistors; innovative SMT; interlayer adhesion; multilayer boards; multilayer surface mount technology; one-shot punching method; Assembly; Lamination; Nonhomogeneous media; Polyimides; Punching; Semiconductor device manufacture; Substrates; Surface treatment; Surface-mount technology; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1989, Proceedings. Seventh IEEE/CHMT International

Conference_Location

San Francisco, CA

Type

conf

DOI

10.1109/EMTS.1989.68991

Filename

68991