• DocumentCode
    3236580
  • Title

    Research on gas film damping of an electrostatically levitated micromachined accelerometer

  • Author

    Liming Wu ; Jingxin Dong ; Fengtian Han ; Zijian Li

  • Author_Institution
    Dept. of precision Instrum. & mechanology, Tsinghua Univ., Tsinghua
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    1081
  • Lastpage
    1086
  • Abstract
    Squeeze film damping and slide film damping for an electrostatically levitated ring-shaped proof-mass are calculated and measured. This paper has derived three-dimensional linearized Reynolds equations for the electrostatically levitated accelerometer based on slip flow condition and Couette fluid model of slide film damping respectively. The gas film damping is determined by using analytic solution with the motion of the proof-mass in five degrees of freedom. Both motion of the proof-mass and temperature effect have been taken into account in gas film damping calculation. The simulated results show that squeeze film damping has dominant effect on dynamics of levitated systems. Electrometric method is utilized to test gas film damping of a levitated accelerometer in axial direction. Experimental results are compared with theoretical analysis.
  • Keywords
    accelerometers; micromachining; microsensors; 3D linearized Reynolds equations; Couette fluid model; analytic solution; electrometric method; electrostatically levitated accelerometer; electrostatically levitated ring-shaped proof-mass; gas film damping; micromachined accelerometer; slide film damping; slip flow condition; squeeze film damping; Accelerometers; Control systems; Damping; Electrodes; Electrostatic measurements; Equations; Mathematical model; Microstructure; Position measurement; Scanning electron microscopy; electrostatic levitation; micro-silicon accelerometer; slide film damping; squeeze film damping;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484506
  • Filename
    4484506