DocumentCode
3236734
Title
Modeling of parasitic inductive effects in power modules
Author
Falck, E. ; Stoisiek, M. ; Wachutka, G.
Author_Institution
Inst. for Phys. of Electrotechnol., Tech. Univ. Munchen, Germany
fYear
1997
fDate
26-29 May 1997
Firstpage
129
Lastpage
132
Abstract
Computer-assisted analysis of the dynamic behavior of the electromagnetic fields inside and outside the bus bar under realistic transient switching conditions allows us to study the details of the resulting current distribution in its interior and other related quantities (such as the heat dissipation). Hence, it proves to be an indispensable prerequisite for the systematic shape optimization of the interconnects and other structural components of a power module. Using a two-stage model for the electromagnetic fields, we tackled the switching problem by decomposing it in a Laplace equation for the quasi-stationary electric field and in a parabolic equation for the rapidly varying electromagnetic field contributions causing the eddy currents. Both equations were solved by means of finite-element methods
Keywords
DC-AC power convertors; Laplace equations; busbars; current distribution; eddy currents; finite element analysis; modules; parabolic equations; power engineering computing; power system transients; transient analysis; DC-AC converter; Laplace equation; bus bar; computer-assisted analysis; current crowding; current distribution; dynamic behavior; eddy currents; electromagnetic fields; finite-element methods; heat dissipation; interconnect shape optimization; parabolic equation; parasitic inductive effects modeling; power modules; quasi-stationary electric field; rapidly varying electromagnetic field contributions; transient switching conditions; two-stage model; Current distribution; Distributed computing; Electromagnetic analysis; Electromagnetic fields; Electromagnetic heating; Electromagnetic transients; Laplace equations; Multichip modules; Shape; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and IC's, 1997. ISPSD '97., 1997 IEEE International Symposium on
Conference_Location
Weimar
ISSN
1063-6854
Print_ISBN
0-7803-3993-2
Type
conf
DOI
10.1109/ISPSD.1997.601452
Filename
601452
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