• DocumentCode
    3237084
  • Title

    Electric properties depending on temperature in SiOC dielectric layer

  • Author

    Oh, Teresa

  • Author_Institution
    Sch. of Electron. & Inf. Eng., Cheongju Univ., Cheongju
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    1199
  • Lastpage
    1203
  • Abstract
    The SiOC Alms by chemical vapor deposition have been researched the electrical properties by leakage current. The chemical properties of SiOC film was divided into organic, hybrid and inorganic types according to the deposition condition. The leakage current also depended on the chemical properties of the films. The current increased on the SiOC film with polarity, which has many grains. These SiOC film with polarity displayed the increasing the current according to the increasing the substrate temperature. However, the SiOC film without grains decreased the leakage current. Especially, the leakage current of the B27 sample with hybrid type decreased due to the increase the substrate temperature. The dependence on the temperature was only found the sample B27. It was confirmed that the SiOC film with hybrid type is more stable low dielectric materials in high temperature.
  • Keywords
    chemical vapour deposition; dielectric materials; electric properties; leakage currents; silicon compounds; SiOC; chemical properties; chemical vapor deposition; dielectric layer; electric properties; leakage current; substrate temperature; Annealing; Chemical vapor deposition; Dielectric constant; Dielectric materials; Leakage current; Pentacene; Plasma temperature; Semiconductor films; Substrates; Temperature dependence; SiOC film; leakage current; pentacene deposited surface; polarity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484532
  • Filename
    4484532