• DocumentCode
    3237462
  • Title

    The effect of filler particle size on ultrasonic image of electrical breakdown region in filler-added insulating materials

  • Author

    Watanabe, E. ; Takeda, Y. ; Yoshizawa, M. ; Moriya, T. ; Nakajima, M.

  • Author_Institution
    Dept. of Electr. Eng., Tokyo Metropolitan Univ., Japan
  • Volume
    2
  • fYear
    1996
  • fDate
    20-23 Oct 1996
  • Firstpage
    697
  • Abstract
    The ultrasonic visualization method proposed provides an effective way to detect or visualize the electrical breakdown region in specimens of organic insulating materials even when filled with powder materials. However, there exist a few problems on ultrasonic visualization for such kinds of resins, mainly due to their peculiar acoustic characteristics, i.e. specific acoustic impedance, heavy signal decay within the material and scattering noises from filler particles. Above all, scattering noises prevent the formation of clear ultrasonic images of the electrical breakdown region. In this paper we report the dependence of filler particle size on the magnitudes of scattering noises reflected from filler particles, and recommend the use of filler materials with smaller particle size for convenient future insulation diagnosis
  • Keywords
    acoustic impedance; composite insulating materials; electric breakdown; epoxy insulation; filled polymers; particle reinforced composites; particle size; trees (electrical); ultrasonic imaging; SiO2 particle filler; electrical breakdown region; epoxy resin; filler particle size; filler-added insulating materials; heavy signal decay; insulation diagnosis; organic insulating materials; powder material filler; resins; scattering noises; specific acoustic impedance; ultrasonic images; ultrasonic visualization; Acoustic noise; Acoustic scattering; Acoustic signal detection; Dielectrics and electrical insulation; Electric breakdown; Organic materials; Particle scattering; Powders; Resins; Visualization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1996., IEEE 1996 Annual Report of the Conference on
  • Conference_Location
    Millbrae, CA
  • Print_ISBN
    0-7803-3580-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.1996.564567
  • Filename
    564567