DocumentCode
3237462
Title
The effect of filler particle size on ultrasonic image of electrical breakdown region in filler-added insulating materials
Author
Watanabe, E. ; Takeda, Y. ; Yoshizawa, M. ; Moriya, T. ; Nakajima, M.
Author_Institution
Dept. of Electr. Eng., Tokyo Metropolitan Univ., Japan
Volume
2
fYear
1996
fDate
20-23 Oct 1996
Firstpage
697
Abstract
The ultrasonic visualization method proposed provides an effective way to detect or visualize the electrical breakdown region in specimens of organic insulating materials even when filled with powder materials. However, there exist a few problems on ultrasonic visualization for such kinds of resins, mainly due to their peculiar acoustic characteristics, i.e. specific acoustic impedance, heavy signal decay within the material and scattering noises from filler particles. Above all, scattering noises prevent the formation of clear ultrasonic images of the electrical breakdown region. In this paper we report the dependence of filler particle size on the magnitudes of scattering noises reflected from filler particles, and recommend the use of filler materials with smaller particle size for convenient future insulation diagnosis
Keywords
acoustic impedance; composite insulating materials; electric breakdown; epoxy insulation; filled polymers; particle reinforced composites; particle size; trees (electrical); ultrasonic imaging; SiO2 particle filler; electrical breakdown region; epoxy resin; filler particle size; filler-added insulating materials; heavy signal decay; insulation diagnosis; organic insulating materials; powder material filler; resins; scattering noises; specific acoustic impedance; ultrasonic images; ultrasonic visualization; Acoustic noise; Acoustic scattering; Acoustic signal detection; Dielectrics and electrical insulation; Electric breakdown; Organic materials; Particle scattering; Powders; Resins; Visualization;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 1996., IEEE 1996 Annual Report of the Conference on
Conference_Location
Millbrae, CA
Print_ISBN
0-7803-3580-5
Type
conf
DOI
10.1109/CEIDP.1996.564567
Filename
564567
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