DocumentCode

3238838

Title

Fatigue and Creep in Solder Joints

Author

Homa, Thomas R. ; Huebner, R.T.

Author_Institution

IBM Corporation, Endicott, NY

fYear

1987

fDate

31896

Firstpage

148

Lastpage

157

Keywords

Capacitive sensors; Capacitors; Creep; Fatigue; Lead; Packaging; Soldering; Substrates; Surface-mount technology; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Southern Tier Technical Conference, 1987. Proceedings of the 1987 IEEE

Type

conf

DOI

10.1109/STIER.1987.716389

Filename

716389