DocumentCode
3239580
Title
Packaging guidelines for PC cards
Author
Marsh, Ed
Author_Institution
Commun. Products Div., AMP Inc., Winston-Salem, NC, USA
fYear
1995
fDate
10-12 Oct 1995
Firstpage
312
Lastpage
314
Abstract
PC cards which comply with the PCMCIA Association´s specification PC Card Standard are available in three basic styles. PC card frame kit packaging provides a rugged user friendly enclosure for applications requiring resistance to mechanical bending, drops, and vibration. The user choice of styles is dependent on their cost budget, manufacturing volumes, and appearance criteria. Most frame kit suppliers have assembly tooling available to assist the user in their manufacturing process. As pricing pressures mount for card manufacturers, frame kit suppliers continue to develop more cost effective designs to meet these needs. This packaging technique has also spread to applications other than PCMCIA cards to capitalise on its assets for consumer electronic PCB packaging
Keywords
add-on boards; digital storage; packaging; PC Card Standard; PC card frame kit packaging; PC cards; PCMCIA Association´s specification; drop resistance; mechanical bending resistance; user friendly enclosure; vibration resistance; Application software; Assembly; Bonding; Guidelines; Insulation; Manufacturing processes; Packaging; Plastics; Steel; Thickness control;
fLanguage
English
Publisher
ieee
Conference_Titel
Northcon 95. I EEE Technical Applications Conference and Workshops Northcon95
Conference_Location
Portland, OR
Print_ISBN
0-7803-2639-3
Type
conf
DOI
10.1109/NORTHC.1995.485088
Filename
485088
Link To Document