• DocumentCode
    3239580
  • Title

    Packaging guidelines for PC cards

  • Author

    Marsh, Ed

  • Author_Institution
    Commun. Products Div., AMP Inc., Winston-Salem, NC, USA
  • fYear
    1995
  • fDate
    10-12 Oct 1995
  • Firstpage
    312
  • Lastpage
    314
  • Abstract
    PC cards which comply with the PCMCIA Association´s specification PC Card Standard are available in three basic styles. PC card frame kit packaging provides a rugged user friendly enclosure for applications requiring resistance to mechanical bending, drops, and vibration. The user choice of styles is dependent on their cost budget, manufacturing volumes, and appearance criteria. Most frame kit suppliers have assembly tooling available to assist the user in their manufacturing process. As pricing pressures mount for card manufacturers, frame kit suppliers continue to develop more cost effective designs to meet these needs. This packaging technique has also spread to applications other than PCMCIA cards to capitalise on its assets for consumer electronic PCB packaging
  • Keywords
    add-on boards; digital storage; packaging; PC Card Standard; PC card frame kit packaging; PC cards; PCMCIA Association´s specification; drop resistance; mechanical bending resistance; user friendly enclosure; vibration resistance; Application software; Assembly; Bonding; Guidelines; Insulation; Manufacturing processes; Packaging; Plastics; Steel; Thickness control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Northcon 95. I EEE Technical Applications Conference and Workshops Northcon95
  • Conference_Location
    Portland, OR
  • Print_ISBN
    0-7803-2639-3
  • Type

    conf

  • DOI
    10.1109/NORTHC.1995.485088
  • Filename
    485088