PC Card product design and packaging considerations

Author

Koon, John W.

Author_Institution

Northstar Syst. Inc., Rancho Cucamonga, CA, USA

fYear

1995

fDate

10-12 Oct 1995

Firstpage

315

Lastpage

322

Abstract

As more and more new PC Card frame kits and I/O connector products become available, product developers will have a variety of choices when designing a PC Card product. The product can be a PC Card fax/modem, fax with a cellular phone connection, LAN, SGSI, fax/LAN combo or fax/modem/sound combo. While it is good to have design choices, it may take up a great deal of developers´ time in sorting out what technologies are good for a particular design. In this paper, the latest packaging technologies and products are examined and the PC Card product design considerations are discussed to provide product developers with some time-saving findings. The discussions are divided into two main sections: the exploration of new PC Card packaging technologies, and PC Card design and packaging considerations

Keywords

add-on boards; computer interfaces; data communication equipment; packaging; peripheral interfaces; product development; I/O connector products; LAN; PC Card fax/modem; PC Card frame kits; PC Card product design; SGSI; cellular phone connection; fax/LAN combination; fax/modem/sound combination; packaging; Assembly; Connectors; Grounding; Modems; Packaging; Pins; Plastics; Product design; Testing; Welding;

fLanguage

English

Publisher

ieee

Conference_Titel

Northcon 95. I EEE Technical Applications Conference and Workshops Northcon95

Conference_Location

Portland, OR

Print_ISBN

0-7803-2639-3

Type

conf

DOI

10.1109/NORTHC.1995.485089

Filename

485089