DocumentCode
3241117
Title
Packaging of image sensor devices for camera module applications - Keynote Speaker
Author
Darveaux, Robert
Author_Institution
Amkor Technology, Inc.,
Volume
2
fYear
2004
fDate
1-4 June 2004
Abstract
Provides an abstract of the keynote presentation and a brief professional biography of the presenter. The complete presentation was not made available for publication as part of the conference proceedings.
Keywords
Assembly; Biological materials; Cameras; Fatigue; Image sensors; Life testing; Mobile handsets; Packaging; Process control; Production;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Conference_Location
Las Vegas, NV, USA
Print_ISBN
0-7803-8357-5
Type
conf
DOI
10.1109/ITHERM.2004.1318241
Filename
1318241
Link To Document