DocumentCode
3241796
Title
Scaling variance, invariance and prediction of design rule: from 0.25-μm to 0.10-μm nodes in the era of foundry manufacturing
Author
Doong, Kelvin Yih-Yuh ; Ting, J.K. ; Hsieh, Sunnys ; Lin, S.C. ; Shen, Binson ; Guo, J.C. ; Young, K.L. ; Chen, L.C. ; Sun, J.Y.-C. ; Wang, J.K.
Author_Institution
Taiwan Semicond. Manuf. Corp., Shinchu, Taiwan
fYear
2001
fDate
2001
Firstpage
38
Lastpage
42
Abstract
The design rules are categorized into two parts: the primitive and the affiliate ones, to excogitate the variance and invariance among the different technology nodes. The scaling trend was characterized and the process control capabilities of design rules were reviewed. Based on the data of in-line methodology and process physical specification, a novel algorithm is enacted to generate the design rule of next generation. The design rule is disassembled into two parts: one is the criteria of electrical specification, and the others are the variations induced by the process sequences. The variations are modeled as the statistical distributions of in-line datum set. Monte Carlo simulation is used to extract the variations of multiple variable process parameters. Then, the design rules can be derived from the criteria of electrical specification, and the summation of the variations of multiple variable process parameters
Keywords
Monte Carlo methods; VLSI; integrated circuit manufacture; integrated circuit measurement; process control; 0.1 to 0.25 micron; Monte Carlo simulation; design rule; electrical specification; foundry manufacturing; in-line methodology; multiple variable process parameters; process control capabilities; process physical specification; process sequences; scaling trend; scaling variance; statistical distributions; Algorithm design and analysis; Etching; Foundries; Job shop scheduling; Kelvin; Manufacturing industries; Printing; Process control; Semiconductor device manufacture; Statistical distributions;
fLanguage
English
Publisher
ieee
Conference_Titel
Statistical Methodology, IEEE International Workshop on, 2001 6yh.
Conference_Location
Kyoto
Print_ISBN
0-7803-6688-3
Type
conf
DOI
10.1109/IWSTM.2001.933822
Filename
933822
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