Modified Anand constitutive model for lead-free solder Sn-3.5Ag

Author

Chen, Xu ; Chen, Gang ; Sakane, Masao

Author_Institution

Dept. of Chem. Eng., Tianjin Univ., China

Volume

2

fYear

2004

fDate

1-4 June 2004

Firstpage

447

Abstract

An improved Anand constitutive model is proposed to describe the inelastic deformation of lead free solder Sn-3.5Ag used in solder joints of microelectronic packaging. The new model accurately predicted the overall trend of steady-state stress-strain behavior of the solder for the temperature range from 233 K to 398 K and the strain rate range from 0.005 s^-1 to 0.1 s^-1·h₀, a constant in the original Anand model, was set to a function of temperature and strain rate in the proposed model. Comparison of the experimental results and simulated results verified that the improved Anand model with modifying h₀ to a function reasonably simulated the inelastic stress-strain relationships.

Keywords

electronics packaging; silver alloys; solders; stress-strain relations; tin alloys; viscoplasticity; 233 to 398 K; Anand constitutive model; Sn-Ag; inelastic deformation; inelastic stress-strain relationships; lead free solder; microelectronic packaging; solder joints; steady state stress-strain relationship; Capacitive sensors; Deformable models; Environmentally friendly manufacturing techniques; Lead; Microelectronics; Packaging; Predictive models; Soldering; Steady-state; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on

Print_ISBN

0-7803-8357-5

Type

conf

DOI

10.1109/ITHERM.2004.1318317

Filename

1318317