DocumentCode
3242934
Title
Composition and stress analysis in Si/SiGe structures
Author
McCarthy, John ; Perova, Tatiana S. ; Moore, R.A. ; Bhattacharya, Surya ; Gamble, Harold S. ; Armstrong, B. Mervyn
Author_Institution
Department of Electronic and Electrical Engineering, University of Dublin, Trinity College, Dublin 2, Ireland
fYear
2004
fDate
8-10 Sept. 2004
Firstpage
226
Lastpage
230
Abstract
Strained Si technology enables improvements in CMOS performance and functionality via replacement of the bulk, cubic-crystal Si substrate with a Si substrate that contains a tetragonally distorted, biaxially strained Si thin film at the surface. Here we use micro-Raman spectroscopy to enable us to characterise growth processes of strained silicon, and to characterise the resulting level of strain/stress in the silicon and the effect it has on the underlying layer of graded SiGe.
Keywords
CMOS technology; Electron mobility; Germanium silicon alloys; MOS devices; MOSFETs; Semiconductor films; Silicon germanium; Spectroscopy; Stress; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical and Electronics Engineering, 2004. (ICEEE). 1st International Conference on
Conference_Location
Acapulco, Mexico
Print_ISBN
0-7803-8531-4
Type
conf
DOI
10.1109/ICEEE.2004.1433882
Filename
1433882
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