Thermal analysis on PCB using Galerkin approach

Author

Soh, Mohd Norhisham Che ; Bugis, Ismadi ; Jamaludin, Irma Wani ; Ranom, Rahifa

Author_Institution

Fac. of Electr. Eng., Univ. Teknikal Malaysia Melaka, Ayer Keroh, Malaysia

fYear

2011

fDate

19-21 April 2011

Firstpage

1

Lastpage

6

Abstract

This paper presents the analysis of temperature rise on PCB. Numerical solutions using Galerkin approach that is one of Finite Element Method (FEM) was used to study and analyze the temperature rise on PCB. Then, an algorithm has been developed using MATLAB. The PCB with four different width of copper is supplied with different range of direct current (DC) from 0.5 to 5 Amperes to capture the data by using FLIR i5 Infrared Thermal Imager. The data then compared with numerical result and obtain an error. In order to minimize the error, an analysis is done based on Galerkin approach with heat transfer film coefficient obtained from the experiment. The numerical results showed good agreement with the experimental results and it can be proved that the algorithm developed based on Galerkin approach can be applied to the thermal analysis on PCB.

Keywords

Galerkin method; finite element analysis; printed circuits; thermal analysis; FEM; Galerkin approach; MATLAB; PCB; current 0.5 A to 5 A; finite element method; heat transfer film coefficient; infrared thermal imager; numerical solutions; thermal analysis; Conductors; Copper; Films; Finite element methods; Heat transfer; Heating; Mathematical model; Finite Element Method (FEM); Galerkin Approach; Heat Transfer; Printed Circuit Board (PCB);

fLanguage

English

Publisher

ieee

Conference_Titel

Modeling, Simulation and Applied Optimization (ICMSAO), 2011 4th International Conference on

Conference_Location

Kuala Lumpur

Print_ISBN

978-1-4577-0003-3

Type

conf

DOI

10.1109/ICMSAO.2011.5775577

Filename

5775577