Preparation and Modification of Soluble Bismaleimide Oligopolymer

Bismaleimide oligopolymer resins have been widely used as insulating material, due to its outstanding mechanical properties, higher thermal stability. However, it has some shortcomings that the melt body viscosity is too heavy and toughness is poor. This article describes the preparation of soluble bismaleimide oligopolymer by chemical imidization method 3,3´-diethyl-4,4´-diamino diphenyl methane (DEDADPM), pyromellitic anhydride (PMDA) and maleic anhydride (MA), with the organic solvent (N,N´-dimethyl acetamide) in the room temperature. The mole proportion of DEDADPM, PMDA and MA is 10, 9, 2. And, unsaturated polyester and cross-linking agent diallyl phthalate (DAP) is used to modificate this system, its some of properties are improved. The result of FR-IR demonstrated that imide ring has already been formed. Heat decomposition temperature (T_d) is 400-500 C. The tensile strength (10% DAP) is 106 MPa. This system can be used as a premium grade matrix resin of composite material