DocumentCode
3252859
Title
Experimental demonstration of thermal management using thermoelectric generation
Author
Solbrekken, Gary L. ; Yazawa, Kazuaki ; Bar-Cohen, Avram
Author_Institution
Dept. of Mech. Eng., Missouri Univ., Columbia, MO, USA
fYear
2004
fDate
1-4 June 2004
Firstpage
284
Abstract
It has been well established that thermal management of electronic equipment is a critical need for the continued success of the microelectronics industry. Portable electronic devices, such as notebook computers and cellular telephones, require that the thermal solution be small, light, and energy efficient. Small-scale thermoelectric (TE) modules can be used to generate electricity from the waste heat of the microprocessor. The electricity can then be used to power the thermal solution. The concept of using a TE module to generate electricity from the waste heat of a microprocessor in a notebook computer class device is discussed by Solbrekken, et. al. In that study, the ´shunt attach´ design configuration is introduced and parametrically explored. Using the models developed in that study, a prototype is designed such that a 25 W processor is kept below 85°C in a 25°C ambient using ´heat-driven cooling´. The prototype built using off-the-shelf TE modules verifies that a 25 W microprocessor can be kept below 85°C in a 25°C ambient, cooled solely by a fan driven with TE generated electricity.
Keywords
cellular radio; cooling; microprocessor chips; modules; notebook computers; thermal management (packaging); thermoelectric conversion; thermoelectric devices; waste heat; 25 W; 25 degC; cellular telephones; cooling; electronic equipment; microelectronics industry; microprocessor waste heat electricity generation; notebook computer class device; off-the-shelf thermoelectric modules; portable electronic devices; shunt attach design; small scale thermoelectric modules; thermal management; thermoelectric generation; Electronic equipment; Microelectronics; Microprocessors; Power generation; Prototypes; Tellurium; Thermal management; Thermal management of electronics; Thermoelectricity; Waste heat;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN
0-7803-8357-5
Type
conf
DOI
10.1109/ITHERM.2004.1319186
Filename
1319186
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