• DocumentCode
    3254007
  • Title

    Pool boiling in saturated and subcooled HFE-7100 dielectric fluid from a porous graphite surface

  • Author

    El-Genk, Mohamed S. ; Parker, Jack L.

  • Author_Institution
    Dept. of Chem. & Nucl. Eng., New Mexico Univ., Albuquerque, NM, USA
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    655
  • Abstract
    Experiments investigated the effects of subcooling on pool boiling of HFE-7100 dielectric liquid from porous graphite measuring 10×10 mm and 3.0 mm thick. Results indicate no temperature excursion at incipient boiling and that subcooled nucleate boiling occurs at surface temperatures well below saturation. Conversely, for a smooth copper surface the temperature overshoot at incipient boiling is as much as 37.4 K in saturation and 7.5-16 K in subcooled nucleate boiling. Nucleate boiling ensues on the porous graphite at 0.8 K in saturation, and -2.0 to -11.7 K in subcooled boiling, compared to 5.0 to 10.9 K on the smooth copper surface. The nucleate boiling heat fluxes are more than 500% higher and the surface superheats are significantly lower than those for the copper surface in same experimental setup. The critical heat flux (CHF) for the porous graphite surface is 31.8, 45.1, 55.9, and 66.4 W/cm2 for saturation, 10 K, 20 K, and 30 K subcooled boiling, and the values for the smooth copper are 21.5, 28.1, 33.7, and 37.3 W/cm2, respectively. In addition, the rate of increase in CHF for the porous graphite with increased subcooling ∼50% higher than for the smooth copper surface.
  • Keywords
    boiling; dielectric liquids; graphite; porous materials; surface structure; thermal conductivity; undercooling; -2.0 to -11.7 K; 0.8 K; 20 K; 3.0 mm; 30 K; 37.4 K; 5.0 to 10.9 K; 7.5 to 16 K; C; boiling heat flux; critical heat flux; pool boiling; porous graphite surface; smooth copper surface; subcooled HFE-7100 dielectric fluid; subcooled nucleate boiling; surface superheat; surface temperature; Coatings; Copper; Dielectric liquids; Heat transfer; Heat treatment; Rough surfaces; Surface roughness; Surface treatment; Temperature; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
  • Print_ISBN
    0-7803-8357-5
  • Type

    conf

  • DOI
    10.1109/ITHERM.2004.1319238
  • Filename
    1319238