• DocumentCode
    3255330
  • Title

    Novel flexible and thin capacitors with Mn-doped SrTiO3 thin films on polyimide films

  • Author

    Yamamichi, Shintaro ; Shibuya, Akinobu

  • Author_Institution
    Jisso & Production Technol. Res. Labs, NEC Corp., Kawasaki, Japan
  • Volume
    1
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    271
  • Abstract
    Novel SrTiO3-based flexible and thin capacitors with total thickness of only 40 μm have been developed as decoupling capacitors. The sputter-deposited SrTiO3 thin film capacitors, with electroplated Cu terminals, are fabricated on polyimide-coated Si substrates using photolithography and thin film process technologies. The capacitor parts, including polyimide, are finally peeled off from the Si substrates. Manganese impurity doping into the SrTiO3 is effective for good uniformity and low temperature deposition down to 250°C. A highly elastic molybdenum film, as a part of the bottom electrodes, successfully suppresses the polyimide contraction during SrTiO3 deposition up to 400°C. The diced flexible capacitor shows a large capacitance density of 3.2 nF/mm2, and low leakage current of 10-7 A/cm2 at 10 V.
  • Keywords
    copper; electroplated coatings; leakage currents; manganese; photolithography; polymer films; sputtered coatings; strontium compounds; thin film capacitors; 10 V; 250 degC; 40 micron; 400 degC; Cu-SrTiO3:Mn; capacitance density; decoupling capacitors; deposition induced polyimide contraction; electroplated terminals; flexible thin capacitors; leakage current; low temperature deposition; photolithography; polyimide films; polyimide-coated substrates; sputter-deposited thin film capacitors; thin film process technologies; Capacitors; Doping; Impurities; Lithography; Manganese; Polyimides; Semiconductor thin films; Sputtering; Substrates; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2004. Proceedings. 54th
  • Print_ISBN
    0-7803-8365-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2004.1319350
  • Filename
    1319350