Thermal analysis of hermetically sealed electromagnetic relay in high and low temperature condition

Author

Wanbin, Ren ; Huimin, Liang ; Guofu, Zhai

Author_Institution

Sch. of Electr. Eng. & Autom., Harbin Inst. of Technol., Harbin

fYear

2006

fDate

25-27 Sept. 2006

Firstpage

110

Lastpage

116

Abstract

Hermetically sealed structure is the optimal style to protect electromagnetic relay (EMR) from formidable working environment. Each product shall be subjected to thermal environment shock in accordance with MIL-STD-202 from -65degC to +125degC temperature, so it is of great importance for thermal analysis of EMR to increase the thermal stability and reliability requirement. In this paper, special finite element analysis (FEM) software ANSYS, was used for the accurate simulation of the internal relay structure. The elevated temperature characteristic of relay is investigated considering comprehensive thermal conductivity and convection effect. Internal complex heat transfer paths of EMR are determined and the influence of different temperature condition of inert gas on thermal performance is also researched. The results of the analysis can be useful for reliability thermal design of hermetically sealed EMR.

Keywords

convection; electromagnetic devices; finite element analysis; hermetic seals; relays; reliability; thermal analysis; thermal conductivity; ANSYS software; convection effect; finite element analysis; hermetically sealed electromagnetic relay; internal complex heat transfer paths; internal relay structure simulation; reliability thermal design; temperature -65 degC to 125 degC; thermal analysis; thermal conductivity; Electric shock; Electromagnetic analysis; Electromagnetic radiation; Hermetic seals; Protection; Protective relaying; Relays; Stability analysis; Temperature; Thermal conductivity; finite element method (FEM); hermetically sealed electromagnetic relay; high and low temperature; thermal analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical contacts - 2006, proceedings of the fifty-second ieee holm conference on

Conference_Location

Montreal, QC

Print_ISBN

1-4244-0581-5

Type

conf

DOI

10.1109/HOLM.2006.284073

Filename

4063109