• DocumentCode
    3257320
  • Title

    Schmitt trigger as an alternative to buffer insertion for delay and power reduction in VLSI interconnects

  • Author

    Saini, Sandeep ; Veeramachaneni, Sreehari ; Kumar, A. Mahesh ; Srinivas, M.B.

  • Author_Institution
    Center for VLSI & Embedded Syst. Technol., Int. Inst. of Inf. Technol.- Hyderabad, Hyderabad, India
  • fYear
    2009
  • fDate
    23-26 Jan. 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In interconnect bus coding techniques the presence of buffers is often ignored. Buffers are used to restore the signal level affected by parasitics. However buffers have a certain switching time that contribute to overall signal delay. Further the transition that happens in interconnects also contribute to crosstalk delay. Thus the overall delay in interconnects is due to combined effect of both buffer and crosstalk delay. Here a replacement of buffers with Schmitt trigger has been proposed for the same purpose of signal restoration. Due to lower threshold voltage of Schmitt trigger signal can rise early and the large noise margin of schmitt trigger helps in reducing the noise glitches as well. Hence we don´t need to add extra hardware for bus coding for the removal of higher crosstalk classes and delay reduction. Simulation results shows that the replacement process gives 59% delay reduction as compared to 45% in case of bus coding.
  • Keywords
    VLSI; buffer circuits; delay circuits; integrated circuit interconnections; trigger circuits; Schmitt trigger; VLSI interconnects; buffer insertion; bus coding; crosstalk delay; delay reduction; delay-power reduction; interconnect bus coding techniques; signal restoration; threshold voltage; Crosstalk; Delay effects; Embedded system; Information technology; Integrated circuit interconnections; Optical buffering; Threshold voltage; Trigger circuits; Very large scale integration; Wire; Schmitt trigger; delay reduction; interconnects;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2009 - 2009 IEEE Region 10 Conference
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-4546-2
  • Electronic_ISBN
    978-1-4244-4547-9
  • Type

    conf

  • DOI
    10.1109/TENCON.2009.5396104
  • Filename
    5396104