• DocumentCode
    3258400
  • Title

    Development of 3-D electromagnetic field intensity measurement system using infrared 2-D lock-in amplifier

  • Author

    Chiyo, N. ; Tanaka, Y. ; Nishikata, A. ; Maeno, T.

  • Author_Institution
    Musashi Inst. of Technol., Tokyo
  • fYear
    2008
  • fDate
    7-11 Sept. 2008
  • Firstpage
    91
  • Lastpage
    94
  • Abstract
    We have developed a 3-D electromagnetic field measurement system using 2-D lock-in amplifier. In this system, a modulated amplitude of electromagnetic wave is illuminated to an absorption screen to generate a heat distribution. A very small change of temperature on a screen illuminated with the modulated electromagnetic wave is measured using an infrared thermograph camera. To show the usefulness of the developed system, we compare the observed temperature change distribution to the optical power distribution emitted from LED light source. From the result, we found that the system is well working and it is possible to measure the temperature change in order of several mK (milli-Kelvin). Furthermore, we tried to use it for measuring an invisible GHz electromagnetic wave. We illuminated the electromagnetic wave to a conductor with shape of ldquoOrdquo. When we observed the temperature change on the screen putting behind the conductor, we can have a clear image of the shape of ldquoOrdquo.
  • Keywords
    electromagnetic fields; electromagnetic waves; 3D electromagnetic field intensity measurement system; electromagnetic wave; infrared 2D lock-in amplifier; modulated amplitude; Amplitude modulation; Conductors; Electromagnetic fields; Electromagnetic heating; Electromagnetic measurements; Electromagnetic scattering; Electromagnetic wave absorption; Optical amplifiers; Shape; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
  • Conference_Location
    Mie
  • Print_ISBN
    978-4-88686-005-7
  • Electronic_ISBN
    978-4-88686-006-4
  • Type

    conf

  • DOI
    10.1109/ISEIM.2008.4664504
  • Filename
    4664504