Vertical integration of pyroelectric detector array and integrated signal processing circuitry

The use of surface-micromachining techniques combined with standard VLSI techniques to fabricate a 64-element*64-element imager for infrared heat detection is described. A large array of pyroelectric detectors (ZnO/PbTiO/sub 3/) was vertically integrated on top of the integrated circuitry. The operation and fabrication of the circuit are described. Device and circuit characterization, carried out prior to and after microsensor processing, showed no significant degradation. The chip area per sensor is significantly reduced by use of surface micromachining rather than bulk machining methods. The ability to fabricate these microsensors in VLSI NMOS and CMOS processes suggests further integration of ZnO-based sensors with high-density standard cell analog and digital building blocks.<>