DocumentCode
3270153
Title
Design of A Low-power, High Speed Op-amp for 10bit 300Msps Parallel Pipeline ADCs
Author
Zhang, Sidong ; Huang, Lu ; Lin, Beiyuan
Author_Institution
Univ. of Sci. & Technol. of China, Hefei
fYear
2007
fDate
20-24 March 2007
Firstpage
504
Lastpage
507
Abstract
This paper presents a low-power operational amplifier suitable for the sample-and-hold (S/H) circuit with the architecture of switched-capacitor circuit .The op-amp plays an important role in the front-rank sampling module and the MDAC (multiplying D/A converter) module for the 10 bit, 300 MHz sampling rate, 4-channel parallel pipeline ADC. This paper presents a design based on optimized time-interleaved technique. By optimizing the channel sampling clock which means there is more time for the op-amp to settle up, the op-amp has a superior performance. With 3.3 V power supply, using the CSM 0.35 mum CMOS process technology, the HSPICE simulation shows that, the open-loop gain of the op-amp is 106 dB with the unity gain bandwidth of 402 MHz and the settling time is 8.8 ns, which is qualified for the requirement of the single channel sampling rate (75 MHz). The power consumption of this op-amp is only 8.57 mW, which significantly reduces the whole power of the parallel pipeline ADC.
Keywords
analogue-digital conversion; operational amplifiers; switched capacitor networks; CMOS process technology; HSPICE simulation; frequency 300 MHz; front-rank sampling module; low-power operational amplifier; multiplying D/A converter module; optimized time-interleaved technique; power 8.57 mW; sample-and-hold circuit; size 0.35 mum; switched-capacitor circuit; voltage 3.3 V; word length 10 bit; CMOS process; CMOS technology; Clocks; Design optimization; Operational amplifiers; Pipelines; Power supplies; Sampling methods; Switched capacitor circuits; Switching converters; S/H circuit; op-amp; parallel pipeline ADC; time-interleaved;
fLanguage
English
Publisher
ieee
Conference_Titel
Integration Technology, 2007. ICIT '07. IEEE International Conference on
Conference_Location
Shenzhen
Print_ISBN
1-4244-1092-4
Electronic_ISBN
1-4244-1092-4
Type
conf
DOI
10.1109/ICITECHNOLOGY.2007.4290367
Filename
4290367
Link To Document