DocumentCode
3272490
Title
Package-Aware Scheduling of embedded workloads for temperature and Energy management on heterogeneous MPSoCs
Author
Sharifi, Shervin ; Rosing, Tajana Simunic
Author_Institution
Comput. Sci. & Eng. Dept., Univ. of California, San Diego, CA, USA
fYear
2010
fDate
3-6 Oct. 2010
Firstpage
521
Lastpage
527
Abstract
In this paper, we present PASTEMP, a solution for Package Aware Scheduling for Thermal and Energy management using Multi- Parametric programming in heterogeneous embedded multiprocessor SoCs (MPSoCs). Based on the current thermal state of the system and current performance requirements of the workload, PASTEMP finds thermally safe and energy efficient voltage/frequency configurations for the cores on a MPSoC. The tasks are assigned to the cores depending on their performance demand and the current voltage/frequency of the core. The voltage/frequency settings of the cores are chosen through an optimization process which is based on the instantaneous thermal model we introduce to decouple the effect of package temperature from the temperature changes caused by the power consumption of the cores. To be able to find the best voltage/frequency settings at runtime, we use multi-parametric programming to separate the optimization into offline and online phases. According to our experimental results, compared to similar DTM techniques, PASTEMP results in up to 23% energy saving and 26% throughput improvement and reduces the deadline misses to more than a half while meeting all thermal constraints.
Keywords
power aware computing; processor scheduling; PASTEMP; embedded workload; energy management; frequency configuration; heterogeneous embedded multiprocessor SoC; multiparametric programming; optimization process; package-aware scheduling; power consumption; temperature management; thermal management; voltage configuration; Optimization; Power demand; Programming; Runtime; Steady-state; Temperature; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design (ICCD), 2010 IEEE International Conference on
Conference_Location
Amsterdam
ISSN
1063-6404
Print_ISBN
978-1-4244-8936-7
Type
conf
DOI
10.1109/ICCD.2010.5647628
Filename
5647628
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