DocumentCode
3272749
Title
Alpha chip packaging challenges of today and tomorrow
Author
Adam, John D. ; Brown, Kenneth
Author_Institution
Digital Equipment Corp., Hudson, MA
fYear
1996
fDate
28-30 Oct 1996
Firstpage
23
Abstract
Summary form only given, as follows. Several generations of Alpha microprocessors have been designed and delivered which have provided industry leading performance. Chip and packaging design for Alpha have worked collaboratively to allow optimization across both spaces to ship at the highest chip performance and lowest packaging cost. The authors review the packaging design methods and technologies developed to meet the cost, performance, and time-to-market goals for a 60 watt, 500 MHz microprocessor utilizing a wirebond, ceramic PGA
Keywords
digital integrated circuits; integrated circuit packaging; microprocessor chips; 500 MHz; 60 W; Alpha chip packaging; Alpha microprocessors; digital ICs; packaging design methods; packaging technologies; pin grid array; support chips; wirebond ceramic PGA;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564764
Filename
564764
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