• DocumentCode
    3273314
  • Title

    On the fidelity of the Ax+B equipment model for clustered photolithography scanners in fab-level simulation

  • Author

    Morrison, James R.

  • Author_Institution
    Dept. of Ind. & Syst. Eng., KAIST, Daejeon, South Korea
  • fYear
    2011
  • fDate
    11-14 Dec. 2011
  • Firstpage
    2029
  • Lastpage
    2039
  • Abstract
    Linear and affine (Ax+B) models are commonly used to model equipment throughput in semiconductor wafer fabricator simulations. We endeavor to assess the quality of such models for the prohibitively expensive clustered photolithography scanner. The simulations demonstrate that such models are of varying quality. They can exhibit significant deviation from the system behavior when the simulation parameters, such as product mix and wafers per lot, change from those used to create the models. The error in throughput can range from about 4% to 60% as the number of wafers per lot varies from 24 to 1. These errors are of particular relevance for studies that consider a change to small lot sizes and high mix, as is predicted in the 450 mm era.
  • Keywords
    integrated circuit manufacture; photolithography; quality management; Ax+B equipment model; clustered photolithography scanners; fab-level simulation; quality assessment; semiconductor wafer fabricator simulations; Computational modeling; Data models; Lithography; Predictive models; Semiconductor device modeling; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference (WSC), Proceedings of the 2011 Winter
  • Conference_Location
    Phoenix, AZ
  • ISSN
    0891-7736
  • Print_ISBN
    978-1-4577-2108-3
  • Electronic_ISBN
    0891-7736
  • Type

    conf

  • DOI
    10.1109/WSC.2011.6147916
  • Filename
    6147916