DocumentCode
3273314
Title
On the fidelity of the Ax+B equipment model for clustered photolithography scanners in fab-level simulation
Author
Morrison, James R.
Author_Institution
Dept. of Ind. & Syst. Eng., KAIST, Daejeon, South Korea
fYear
2011
fDate
11-14 Dec. 2011
Firstpage
2029
Lastpage
2039
Abstract
Linear and affine (Ax+B) models are commonly used to model equipment throughput in semiconductor wafer fabricator simulations. We endeavor to assess the quality of such models for the prohibitively expensive clustered photolithography scanner. The simulations demonstrate that such models are of varying quality. They can exhibit significant deviation from the system behavior when the simulation parameters, such as product mix and wafers per lot, change from those used to create the models. The error in throughput can range from about 4% to 60% as the number of wafers per lot varies from 24 to 1. These errors are of particular relevance for studies that consider a change to small lot sizes and high mix, as is predicted in the 450 mm era.
Keywords
integrated circuit manufacture; photolithography; quality management; Ax+B equipment model; clustered photolithography scanners; fab-level simulation; quality assessment; semiconductor wafer fabricator simulations; Computational modeling; Data models; Lithography; Predictive models; Semiconductor device modeling; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation Conference (WSC), Proceedings of the 2011 Winter
Conference_Location
Phoenix, AZ
ISSN
0891-7736
Print_ISBN
978-1-4577-2108-3
Electronic_ISBN
0891-7736
Type
conf
DOI
10.1109/WSC.2011.6147916
Filename
6147916
Link To Document