A multilayer board-type magnetic field probe with high spatial resolution and RF current estimation method for ICs

Author

Masuda, Norio ; Tamaki, Naoya ; Wabuka, Hiroshi ; Watanabe, Takeshi ; Ishizaka, Kazuyoshi

Author_Institution

EMC Eng. Center, NEC Corp., Kawasaki, Japan

fYear

1999

fDate

1999

Firstpage

801

Abstract

The authors describe how NEC and NEC Glass Components Co. Ltd. developed a magnetic field probe with high spatial resolution enabling the measurement of magnetic fields near IC packages and dense-printed circuit boards (PCBs) so that RF currents can be estimated. The design of the magnetic field probe is based on a multilayer board, and achieves spatial resolutions at least 1.8 times those of previous probes, as well as a reduction by up to 30% in the external dimensions of the detection unit (loop area is 0.2 x 8.4 mm). They also developed a test-board design and a magnetic-field measuring method over a printed wiring pattern (microstrip line) which can be applied to LSI testers

Keywords

electromagnetic compatibility; electromagnetic interference; integrated circuit testing; magnetic field measurement; printed circuit testing; probes; IC packages; IC test equipment; LSI testers; RF current estimation method; RF currents estimation; dense-printed circuit boards; magnetic fields measurement; magnetic-field measuring method; microstrip line; multilayer board-type magnetic field probe; printed wiring pattern; spatial resolution; test-board design; Current measurement; Glass; Magnetic field measurement; Magnetic fields; Magnetic multilayers; National electric code; Probes; Radiofrequency integrated circuits; Spatial resolution; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1999 International Symposium on

Conference_Location

Tokyo

Print_ISBN

4-9980748-4-9

Type

conf

DOI

10.1109/ELMAGC.1999.801460

Filename

801460