DocumentCode
3273817
Title
Design and simulation of novel optoelectronic interconnect using photonic crystal virtual waveguide with robust fabrication and misalignment tolerances
Author
Yamashita, Tsuyoshi ; Summers, Christopher J.
Author_Institution
Sch. of Material Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
2
fYear
2004
fDate
1-4 June 2004
Firstpage
1382
Abstract
A virtual waveguide system, utilizing self-collimated beams and photonic band gap mirrors in photonic crystals, is evaluated for applicability in an on-chip interconnect system. Simulations using the plane wave expansion and finite difference time domain methods are utilized to design and evaluate the theoretical performance of these virtual waveguides. The effect of systematic and random fabrication errors on the performance is characterized. Coupling efficiency is virtually unaffected by misalignment, but is found to be a strong function of the length of the waveguide and the frequency of light. Additional routing capabilities of sharp 90° turns and signal crossings with no crosstalk are demonstrated. Photonic crystal virtual waveguides are ideal structures for on-chip optical signal routing.
Keywords
finite difference time-domain analysis; integrated optoelectronics; mirrors; optical collimators; optical interconnections; optical waveguides; photonic crystals; FDTD; PWE; coupling efficiency; fabrication tolerances; finite difference time domain method; misalignment tolerances; on-chip interconnect system; optical signal routing; optoelectronic interconnect; photonic band gap mirrors; photonic crystal virtual waveguide; plane wave expansion method; self-collimated beams; sharp turns; zero crosstalk signal crossings; Finite difference methods; Mirrors; Optical device fabrication; Optical waveguides; Photonic band gap; Photonic crystals; Robustness; Routing; System-on-a-chip; Waveguide discontinuities;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN
0-7803-8365-6
Type
conf
DOI
10.1109/ECTC.2004.1320292
Filename
1320292
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