• DocumentCode
    3275011
  • Title

    Multi-level education curriculum of electronic manufacturing engineering in GUET

  • Author

    Yang, Dong Gyu ; Sun, N. ; Ma, X.S.

  • Author_Institution
    Dept. of Mech. Eng., Guilin Univ. of Electron. Technol., China
  • Volume
    2
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    1716
  • Abstract
    Electronics manufacturing has become a significant sector in manufacturing industry. The fast developing electronics industry challenges the conventional university education. How to adjust the education curriculum to provide qualified engineers for the electronics industry is a challenging task for a university of electronic technology. This paper summarizes the experience in the field of electronics manufacturing engineering education in Guilin University of Electronic Technology, China. In the Department of Mechanical Engineering, multi-level education curriculum in the field of electronics manufacturing engineering has been established through more than one decade effort. Specialized courses in electronics assembly and packaging are provided for the undergraduates in the traditional specializations such as Mechanical Design, Manufacturing and Automation. For the MS graduate students, education in this field is realized through the specialized courses and packaging and assembly-related thesis research projects. Many students found a job in the big electronics companies, mostly benefiting from the courses provided in the university. A new specialization of B.S program in the name of "Microelectronics Manufacturing Engineering" has been set up within the department. The university becomes the first and the only university so far in China to setup such a specialization.
  • Keywords
    continuing education; educational courses; educational institutions; electronic engineering education; electronics industry; electronics packaging; further education; industrial engineering; China university; Guilin University of Electronic Technology; continuing education; conventional university education; electronic manufacturing engineering; electronics assembly; electronics industry challenges; electronics packaging; graduate level; microelectronics manufacturing engineering; multilevel education curriculum; undergraduate level; Assembly; Design automation; Educational technology; Electronics industry; Electronics packaging; Engineering education; Industrial electronics; Manufacturing automation; Mechanical engineering; Pulp manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2004. Proceedings. 54th
  • Print_ISBN
    0-7803-8365-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2004.1320349
  • Filename
    1320349