Modeling and hardware correlation of power distribution networks for multi-gigabit designs

Author

Schmitt, Ralf ; Huang, Xuejue ; Yang, Ling ; Yuan, Xingchao Chuck

Author_Institution

Rambus Inc., Los Altos, CA, USA

Volume

2

fYear

2004

fDate

1-4 June 2004

Firstpage

1759

Abstract

This paper presents simulation and measurement results for package and board power distribution systems of a low cost multi-gigabit design. A modeling methodology aimed to model the entire power distribution system across three different hierarchies of the system from the PCB to the package and to on-chip circuits in a single model is presented. Using this model system trade-offs are demonstrated in the design of the power distribution system of a high-speed memory interface.

Keywords

electronics packaging; equivalent circuits; frequency-domain analysis; lumped parameter networks; power supply circuits; time-domain analysis; transient analysis; electromagnetic wave propagation effects; equivalent circuits; field simulator; frequency domain; hardware correlation; high-speed memory; low cost design; lumped elements; modeling methodology; multigigabit designs; on-chip circuits; package design; parallel plate transmission lines; power distribution networks; supply voltage fluctuations; system tradeoffs; time domain; transient waveform; Capacitors; Circuit simulation; Frequency; Hardware; Impedance; Packaging; Power distribution; Power system modeling; Power systems; Voltage fluctuations;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1320356

Filename

1320356