• DocumentCode
    3275139
  • Title

    Microelectromechanical systems: interfacing electronics to a non-electronic world

  • Author

    Wise, K.D.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
  • fYear
    1996
  • fDate
    8-11 Dec. 1996
  • Firstpage
    11
  • Lastpage
    18
  • Abstract
    Microelectromechanical systems (MEMS) merging integrated sensors, microactuators, and low-power electronics are rapidly growing in sophistication. Projection displays, IR/thermal imagers, print heads, microphones, accelerometers and gyros are all emerging based on this technology. Using embedded microprocessors, complete microsystems employing self-testing and digital compensation promise to achieve levels of reliability and accuracy previously impossible at low cost. Sensors for advanced semiconductor process tools, modules for distributed environmental monitoring, inertial-grade navigation aids, advanced security systems, and mass storage devices are a few of the applications being targeted. The technology choices, device structures, applications, and tradeoffs in this area are examined in this paper along with future challenges.
  • Keywords
    built-in self test; environmental testing; integrated circuit reliability; integrated circuit testing; micromechanical devices; accelerometers; advanced security systems; digital compensation; distributed environmental monitoring; embedded microprocessors; gyros; inertial-grade navigation aids; integrated sensors; low-power electronics; mass storage devices; microactuators; microelectromechanical systems; microphones; print heads; projection displays; reliability; self-testing; thermal imagers; Displays; Head; Low power electronics; Merging; Microactuators; Microelectromechanical systems; Micromechanical devices; Microphones; Rapid thermal processing; Sensor systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1996. IEDM '96., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-3393-4
  • Type

    conf

  • DOI
    10.1109/IEDM.1996.553029
  • Filename
    553029