Design of multiband baluns on liquid crystalline polymer (LCP) based substrates

Author

Govind, Vinu ; Dalmia, Sidharth ; Sundaram, Venky ; White, George E. ; Swaminathan, Madhavan

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., USA

Volume

2

fYear

2004

fDate

1-4 June 2004

Firstpage

1812

Abstract

Baluns operating at multiple frequency bands can result in a reduction in the size of multiband RF front-ends. This paper presents novel multiband balun topologies, using both distributed as well as lumped components. Using LCP packaging technology, baluns operating simultaneously at the 930 and 2000 MHz frequency bands have been fabricated. Measurements show -14.5 dB and -32.4 dB return loss in the lower and upper bands. The phase and amplitude imbalances are less than 2.5° and 0.6 dB in each band.

Keywords

UHF circuits; baluns; electronics packaging; liquid crystal polymers; plastic packaging; 14.5 dB; 2000 MHz; 32.4 dB; 930 MHz; LCP based substrates; LCP packaging technology; distributed components; liquid crystalline polymer; lumped components; multiband RF front-ends; multiband baluns; multiple frequency band baluns; Crystallization; Energy consumption; Impedance matching; Liquid crystal polymers; Packaging; Power transmission lines; Protocols; Radio frequency; Stacking; Topology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1320365

Filename

1320365