DocumentCode
3275328
Title
Sensitivity analysis for on-chip ΔI-noise simulation
Author
Kemmler, Bernd ; Huber, Alex
Author_Institution
Packaging Dev., IBM Deutschland Entwicklung GmbH, Germany
Volume
2
fYear
2004
fDate
1-4 June 2004
Firstpage
1819
Abstract
Power integrity gets increasing attention in the design of electronic packaging. Part of this discussion is the on-chip ΔI-noise. This paper presents a sensitivity analysis for high-frequency on-chip power noise distribution. The results help to optimize the effort required to achieve the needed accuracy of simulation. A generic description of the on-chip ΔI-noise simulation methodology is shown. In particular, the required input data is described. A sensitivity analysis has been performed to quantify the impact of each simulation parameter on the results. The nominal value of each input parameter has been varied in a range from 0.5× to 2.0× compared to a nominal case. The maximum ΔI-noise is plotted depending on the input parameter. The comparison to the nominal case shows which of the parameters have a high, medium or low impact on the simulated ΔI-noise. This paper shows which input parameter need to be accurate in order to obtain accurate simulation results.
Keywords
circuit simulation; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; sensitivity analysis; electronic packaging; high-frequency on-chip power noise distribution; on-chip ΔI-noise simulation; power integrity; sensitivity analysis; simulation accuracy; Analytical models; Capacitance; Inductance; Packaging; Power grids; Power transmission lines; Pulse measurements; Sensitivity analysis; Voltage; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN
0-7803-8365-6
Type
conf
DOI
10.1109/ECTC.2004.1320366
Filename
1320366
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