• DocumentCode
    3275328
  • Title

    Sensitivity analysis for on-chip ΔI-noise simulation

  • Author

    Kemmler, Bernd ; Huber, Alex

  • Author_Institution
    Packaging Dev., IBM Deutschland Entwicklung GmbH, Germany
  • Volume
    2
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    1819
  • Abstract
    Power integrity gets increasing attention in the design of electronic packaging. Part of this discussion is the on-chip ΔI-noise. This paper presents a sensitivity analysis for high-frequency on-chip power noise distribution. The results help to optimize the effort required to achieve the needed accuracy of simulation. A generic description of the on-chip ΔI-noise simulation methodology is shown. In particular, the required input data is described. A sensitivity analysis has been performed to quantify the impact of each simulation parameter on the results. The nominal value of each input parameter has been varied in a range from 0.5× to 2.0× compared to a nominal case. The maximum ΔI-noise is plotted depending on the input parameter. The comparison to the nominal case shows which of the parameters have a high, medium or low impact on the simulated ΔI-noise. This paper shows which input parameter need to be accurate in order to obtain accurate simulation results.
  • Keywords
    circuit simulation; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; sensitivity analysis; electronic packaging; high-frequency on-chip power noise distribution; on-chip ΔI-noise simulation; power integrity; sensitivity analysis; simulation accuracy; Analytical models; Capacitance; Inductance; Packaging; Power grids; Power transmission lines; Pulse measurements; Sensitivity analysis; Voltage; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2004. Proceedings. 54th
  • Print_ISBN
    0-7803-8365-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2004.1320366
  • Filename
    1320366