DocumentCode
3276847
Title
Proceedings 4th Electronics Packaging Technology Conference (EPTC 2002) (Cat. No.02EX566)
fYear
2002
fDate
10-12 Dec. 2002
Keywords
adhesives; assembling; electronic equipment manufacture; electronic equipment testing; failure analysis; interconnections; micromechanical devices; modelling; modules; packaging; reliability; simulation; soldering; thermal analysis; MEMS packaging; adhesives; advanced materials; electrical design; electrical test; failure analysis; interconnects; lead free solder reliability; manufacturing technologies; modules; optical components; package thermal modeling; signal integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2002. 4th
Conference_Location
Singapore
Print_ISBN
0-7803-7435-5
Type
conf
DOI
10.1109/EPTC.2002.1185586
Filename
1185586
Link To Document