Structure function evaluation of stacked dies

In this paper simulation experiments demonstrate, that the structure function evaluation of the thermal transient testing is capable to locate die attach failure(s) of stacked die packages. The strength and the location of the die attach failure may be determined with the methodology of a fast thermal transient measurement and the subsequent computer evaluation. The special advantage of the methodology is that normally it does not require any additional circuit elements on any of the dies of the stacked die structure. The paper demonstrates the feasibility of the method both for stacked die structures of the same die size, and for pyramidal stacked die packages.