DocumentCode
3282409
Title
Automatic measurement-based characterization of lossy MCM line using lumped elements
Author
Corey, S.D. ; Kerns, K.J. ; Yang, A.T.
Author_Institution
Washington Univ., Seattle, WA
fYear
1996
fDate
28-30 Oct 1996
Firstpage
144
Lastpage
146
Abstract
A general approach is outlined for automatically extracting a SPICE model to characterize a measurable linear circuit over a frequency range. A lossy MCM transmission line is characterized and the simulated response is verified against measurement
Keywords
SPICE; automatic testing; lumped parameter networks; multichip modules; packaging; transient response; transmission lines; SPICE model; automatic measurement-based characterization; impulse response; interconnect circuitry; lossy MCM line; lossy MCM transmission line; lumped elements; measurable linear circuit; packaging; simulated response;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564811
Filename
564811
Link To Document