A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate

This paper reports a novel accelerometer which is fabricated in LTCC thick-film process technology. The authors have introduced a LTCC compatible design and developed a fabrication process flow of this new kind of accelerometer. It is designed as a capacitive accelerometer, which consists of a seismic mass, four folded tie-beams, a fixed frame and two packaging plates. The sensing device is embedded in the LTCC substrate. The capacitive signals are conducted by LTCC multilayer interconnection and input to the signal detecting ASIC chip which is mounted on the substrate. The whole module functions as a system-in-package (SiP). The mechanical and electrical characterizations have been investigated by simulation.