A multilayered triplexer based on interdigital filter topology with PCB technology

A multilayer triplexer for multi-band wireless communication systems is presented. The triplexer utilizes multilayer matching networks and three interdigital filters. It has low insertion loss, good return loss and high isolation in each band. Board size is reduced by using a multilayer structure that can be built by standard printed circuit board fabrication process. Three bands with high selectivity are obtained in S band. A good agreement between simulation and measurement results is achieved.