Modeling of MEMS reliability in shock environments

To determine the reliability of MEMS devices in shock environments, in this paper, we present a method that can be used to formulate the responses of microcantilever under shock loads by taking it as a distributed-parameter system. The displacements and stresses of microcantilever are formulated with the mode superposition method. The failure modes may be estimated by the maximum displacement and stress. This method can be also used in other complicated MEMS structures and devices, therefore the reliability designs of MEMS can be improved greatly.