DocumentCode
3287761
Title
Surface wave in a semiconductor substrate with a groundplane
Author
El-Dessouki, Mohamed ; Wong, Thomas
Author_Institution
Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
fYear
2003
fDate
15-17 Oct. 2003
Firstpage
369
Lastpage
371
Abstract
A full-wave and charge transport formulation is applied to the analysis of the dominant TM mode guided by a semiconductor substrate backed by a ground plane. Closed form expressions for the field components, charge density, and current density are obtained, along with characteristic equations for the propagation constant and transverse wave numbers. Numerical results on the wave parameters are obtained for different doping levels. The screening effect of the charge carriers on the transverse component of the electric field is observed to be negligible for an intrinsic semiconductor substrate, but gradually approaching that of a metallic conductor as the doping level reaches 1018 cm-3. An equivalent circuit for the structure is constructed to facilitate the development of the dispersion equation while providing physical insight to the process of the wave-charge interaction on the semiconductor surface.
Keywords
current density; dispersion (wave); electromagnetic field theory; electromagnetic wave propagation; equivalent circuits; semiconductor doping; semiconductor process modelling; substrates; surface electromagnetic waves; waveguide theory; TM mode; characteristic equations; charge density; charge transport analysis; closed form expressions; current density; dispersion equation; doping levels; equivalent circuit; field components; full-wave analysis; groundplane; propagation constant; screening effect; semiconductor substrate; surface wave; transverse wave numbers; wave propagation; Charge carriers; Current density; Equivalent circuits; Frequency; Maxwell equations; Semiconductor device doping; Semiconductor waveguides; Substrates; Surface treatment; Surface waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Wireless Communication Technology, 2003. IEEE Topical Conference on
Print_ISBN
0-7803-8196-3
Type
conf
DOI
10.1109/WCT.2003.1321563
Filename
1321563
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