• DocumentCode
    3288502
  • Title

    An implementation of interleaved microstrip motherboard routing in Multi-Gbps I/O channel margin improvement

  • Author

    Yih Jye Tan ; Heck, H. ; Kong, Jackson ; Wei Jern Tan

  • Author_Institution
    PC Client Group, Intel Corp., Kulim, Malaysia
  • fYear
    2012
  • fDate
    21-24 Oct. 2012
  • Firstpage
    299
  • Lastpage
    302
  • Abstract
    This paper presents an interleaved routing method for motherboard microstrip routing in Multi-Gbps interfaces. The proposed method yields improved channel performance in terms of Eye Height(mV) and Eye Width(ps) margins. Of note is the more prominent improvement in topologies with longer transmission lines. This method enables greater routing flexibility using full microstrip transmission lines with the benefit of improved channel margins at 20 mils inter-pair spacing. More importantly, it allows for the more tightly spaced 15 mils interpair spacing to be utilized without jeopardizing overall channel margins. Ultimately, this translates into a cost saving benefit in line with recent platforms´ sleek and thin form factor.
  • Keywords
    microstrip lines; network routing; transmission lines; eye height margin; eye width margin; full microstrip transmission lines; interleaved microstrip motherboard routing method; interpair spacing; multiGbps I/O channel margin improvement; thin form factor; transmission lines; Couplings; Crosstalk; Microstrip; Power transmission lines; Receivers; Routing; Topology; Far-End Crosstalk; channel margin improvement; interleaved motherboard main-route; multi-Gbps interfaces;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
  • Conference_Location
    Tempe, AZ
  • Print_ISBN
    978-1-4673-2539-4
  • Electronic_ISBN
    978-1-4673-2537-0
  • Type

    conf

  • DOI
    10.1109/EPEPS.2012.6457901
  • Filename
    6457901