A multilayer RRAM nanoarchitecture with resistively switching Ag-doped spin-on glass

Next generation memory materials and novel memory architectures are in the focus of investigations because CMOS based systems are supposed to reach their physical limits during the next decade. To enhance the potential for very high integration density we fabricated multilayer crossbar memory architectures with integrated spin-on glass (methyl-silsesquioxane-MSQ). UV nanoimprint lithography, a widely proposed future technology, was used to structure down to 100 nm feature sizes. Electrical measurements on silver doped MSQ devices show the potential for the use of the material composition in the field of future memory applications.