DocumentCode
3292466
Title
Multilevel flash cells and their trade-offs
Author
Eitan, B. ; Kazerounian, R. ; Roy, A. ; Crisenza, G. ; Cappelletti, P. ; Modelli, A.
Author_Institution
WSI Inc., Fremont, CA, USA
fYear
1996
fDate
8-11 Dec. 1996
Firstpage
169
Lastpage
172
Abstract
In this paper we compare six different multilevel flash cells, viz., common ground, DINOR, AND, AMG, split gate and NAND. The key conclusions are that the hot electron effect lends itself better than tunneling as the multilevel programming mechanism. The common ground cell is the most suitable for multilevel flash cells. The NAND architecture is the least favorable.
Keywords
EPROM; NAND circuits; hot carriers; integrated memory circuits; tunnelling; AMG cell; AND architecture; DINOR cell; NAND architecture; common ground cell; hot electron effect; multilevel flash cells; multilevel programming mechanism; split gate cell; tunneling; Channel hot electron injection; Circuits; Complexity theory; Costs; Low voltage; Maintenance; Parallel programming; Threshold voltage; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1996. IEDM '96., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Print_ISBN
0-7803-3393-4
Type
conf
DOI
10.1109/IEDM.1996.553147
Filename
553147
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