DocumentCode
3293363
Title
Wire Bonder Mis-Process Reduction and Productivity Improvement with Full Automation System by Cross Regional Team
Author
Theam, Tay Chai ; Miyake, Kenji ; Minor, Karl ; Maruoka, Motoaki ; Watanabe, Shingo ; Angeles, Elsa ; Micua, Jose Dennis ; Lu, Louis
Author_Institution
Texas Instrum. Inc., Kuala Lumpur
fYear
2006
fDate
25-27 Sept. 2006
Firstpage
85
Lastpage
88
Abstract
This paper will discuss an approach and solution to effective used software automation to improve productivity and product quality in all TI assembly plants. The project team include members from United States, Malaysia, Philippine, Republic of China, Mexico and Japan. As ONE IT team, project members developed this system and fan-out the software to their respective plant. With developers from many countries, a good project management is a must to execute the plan. The team used weekly teleconference and net-meeting to update the status and discuss any obstacles facing by each member, until the success of the project.
Keywords
lead bonding; project management; cross regional team; net-meeting; productivity improvement; project management; software automation; teleconference; wire bonder misprocess reduction; Assembly; Automation; Bonding; Certification; Gold; Instruments; Production; Productivity; Semiconductor devices; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location
Tokyo
ISSN
1523-553X
Print_ISBN
978-4-9904138-0-4
Type
conf
DOI
10.1109/ISSM.2006.4493029
Filename
4493029
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