• DocumentCode
    3293363
  • Title

    Wire Bonder Mis-Process Reduction and Productivity Improvement with Full Automation System by Cross Regional Team

  • Author

    Theam, Tay Chai ; Miyake, Kenji ; Minor, Karl ; Maruoka, Motoaki ; Watanabe, Shingo ; Angeles, Elsa ; Micua, Jose Dennis ; Lu, Louis

  • Author_Institution
    Texas Instrum. Inc., Kuala Lumpur
  • fYear
    2006
  • fDate
    25-27 Sept. 2006
  • Firstpage
    85
  • Lastpage
    88
  • Abstract
    This paper will discuss an approach and solution to effective used software automation to improve productivity and product quality in all TI assembly plants. The project team include members from United States, Malaysia, Philippine, Republic of China, Mexico and Japan. As ONE IT team, project members developed this system and fan-out the software to their respective plant. With developers from many countries, a good project management is a must to execute the plan. The team used weekly teleconference and net-meeting to update the status and discuss any obstacles facing by each member, until the success of the project.
  • Keywords
    lead bonding; project management; cross regional team; net-meeting; productivity improvement; project management; software automation; teleconference; wire bonder misprocess reduction; Assembly; Automation; Bonding; Certification; Gold; Instruments; Production; Productivity; Semiconductor devices; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-4-9904138-0-4
  • Type

    conf

  • DOI
    10.1109/ISSM.2006.4493029
  • Filename
    4493029