Thermal analysis of ICS based on equivalent thermal resistance and skill language

Author

Zhang, Bin ; Su, Rong ; Feng, Shiwei ; Zhang, Guangchen ; Guo, Chunsheng ; Liu, Yin ; Ding, Kaikai

Author_Institution

Sch. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China

fYear

2009

fDate

6-10 July 2009

Firstpage

538

Lastpage

540

Abstract

The thermal analysis of ICs has been studied in different methods for years. In this paper, a new method to analyze the steady-state temperature distribution of integrated circuit is presented. According to equivalent thermal resistance formula obtaining by an aid tool ANSYS and programming idea, the temperature distribution graph of an analog integrated circuit is obtained. And the result is verified by a complete ANSYS analysis.

Keywords

analogue integrated circuits; temperature distribution; thermal analysis; thermal management (packaging); ANSYS; analog integrated circuit; equivalent thermal resistance; integrated circuits; skill language; steady-state temperature distribution; temperature distribution graph; thermal analysis; Analog integrated circuits; Circuit simulation; Circuit synthesis; Electronic packaging thermal management; Information analysis; Steady-state; Temperature distribution; Thermal engineering; Thermal resistance; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the

Conference_Location

Suzhou, Jiangsu

ISSN

1946-1542

Print_ISBN

978-1-4244-3911-9

Electronic_ISBN

1946-1542

Type

conf

DOI

10.1109/IPFA.2009.5232590

Filename

5232590