DocumentCode
3295082
Title
Structural Properties of A1N Thin Films Deposited on Si Using 3C-SiC Buffer Layer
Author
Lee, Tae-Won ; Chung, Gwiy-Sang
Author_Institution
Univ. of Ulsan, Ulsan
fYear
2007
fDate
June 1 2007-July 5 2007
Firstpage
27
Lastpage
29
Abstract
Polycrystalline aluminum nitride thin films were deposited on polycrystalline 3C-SiC buffer layers by pulsed reactive magnetron sputtering system. Structural properties of AlN/3C-SiC thin films were investigated experimentally by means of FE-SEM, X-ray diffraction, and FT-IR. The columnar structure of AlN thin films was observed by FE-SEM. Results of XRD and FT-IR shows that AlN films on SiC layers were highly (002) oriented. It was determined from infrared absorbance spectrum that the residual stress of AlN thin films grown on SiC layers was almost free. The presented results show that AlN thin films on 3C-SiC buffer layer can be used for M/NEMS applications.
Keywords
Fourier transform spectra; X-ray diffraction; aluminium compounds; buffer layers; infrared spectra; internal stresses; piezoelectric semiconductors; scanning electron microscopy; semiconductor thin films; silicon compounds; sputter deposition; AlN; Fourier transform infrared spectroscopy; Si; SiC; X-ray diffraction; aluminum nitride; buffer layers; polycrystalline thin films; pulsed reactive magnetron sputtering; residual stress; scanning electron microscopy; Aluminum nitride; Buffer layers; Infrared spectra; Residual stresses; Semiconductor thin films; Silicon carbide; Sputtering; Transistors; X-ray diffraction; X-ray scattering; 3C-SiC; AIN; piezoelectric properties;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Materials, 2007. EDM '07. 8th Siberian Russian Workshop and Tutorial on
Conference_Location
Erlagol, Altai
ISSN
1815-3712
Print_ISBN
978-5-7782-0752-3
Type
conf
DOI
10.1109/SIBEDM.2007.4292897
Filename
4292897
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